In general, I am interested in high performance and energy-efficient VLSI computation that support communication, signal
processing, error correction, and biomedical applications. These include:
Many core processors for biomedical imaging
Ultra low power DSP for health care monitoring
Algorithm and architecture enhancements
Compressive sensing reconstructon
Low density parity check codes (LDPC)
Multiple-input multiple-output (MIMO)
Software-defined radios
Application mapping/software development on many-core architectures
VLSI design of ASICs and reconfigurable architectures
Single-chip solutions targeted for low-power embedded systems through a co-design of
programmable cores and application-specific processors.
There are currently openings for Ph.D. students with outstanding academic records. A completed
MS, research experience, and publications are reccommended. Please contact me if you are
interested.
Dean N. Truong, Wayne H. Cheng, Tinoosh Mohsenin, Zhiyi Yu,
Anthony T. Jacobson, Gouri Landge, Michael J. Meeuwsen,
Christine Watnik, Anh T. Tran, Zhibin Xiao, Eric W. Work,
Jeremy W. Webb, Paul V. Mejia, Bevan M. Baas,
"A 167-Processor Computational
Platform in 65 nm CMOS," IEEE Journal of Solid-State Circuits (JSSC),
vol. 44, no. 4, pp. 1130-1144, April 2009. Invited.
Zhiyi Yu, Michael Meeuwsen, Ryan Apperson, Omar Sattari, Michael Lai,
Jeremy Webb, Eric Work, Dean Truong, Tinoosh Mohsenin, Bevan Baas,
"AsAP: An
Asynchronous Array of Simple Processors," IEEE Journal of Solid-State Circuits (JSSC),
vol. 43, no. 3, pp. 695-705, March 2008.
Bevan Baas, Zhiyi Yu, Michael Meeuwsen, Omar Sattari, Ryan Apperson,
Eric Work, Jeremy Webb, Michael Lai, Tinoosh Mohsenin, Dean Truong,
Jason Cheung,
"AsAP:
A Fine-grain Multi-core Platform for DSP Applications," IEEE Micro, Volume 27, Number 2, March/April 2007. Invited.
Zhiyi Yu, Michael Meeuwsen, Ryan Apperson, Omar Sattari, Michael Lai,
Jeremy Webb, Eric Work, Tinoosh Mohsenin, Mandeep Singh, Bevan M. Baas,
"An Asynchronous
Array of Simple Processors for DSP Applications,"
In Proceedings of the IEEE International Solid-State Circuits
Conference (ISSCC '06), February 2006, pp. 428-429, 663.